The AI revolution just entered a new dimension—literally. We are excited to announce that Broadcom has begun shipping the industry’s first 2nm custom compute ASIC, built on our groundbreaking 3.5D eXtreme Dimension System in Package (XDSiP) platform. As AI clusters scale toward gigawatt-level demands, the “old way” of building chips isn’t enough. Our 3.5D F2F (Face-to-Face) technology changes the game by combining 2.5D techniques with 3D-IC integration. This modular approach allows compute, memory, and network I/O to scale independently, delivering a trifecta of performance: * Unparalleled Signal Density: Maximizing throughput in a compact form factor. * Superior Power Efficiency: Unlocking high-efficiency computing to meet massive AI demands. * Ultra-Low Latency: Essential for the next generation of XPUs. The AI revolution requires more than just innovation; it requires execution at scale that Broadcom consistently delivers. Read the full announcement here:
Broadcom Ships 3.5D Face-to-Face Compute SoC…
We are excited to announce that Broadcom has begun shipping the industry’s first 2nm custom compute ASIC, built on our groundbreaking 3.5D eXtreme Dimension System in Package (XDSiP) platform.
Virtual Building Blocks 